1. Effective Thermal Conductivity
A microstructure-sensitive property that mesures the rate at which heat is transferred through a material. Proper processing using sintering additives and the formation of desirable second phases and control of texture, high thermal conductivity AIN, SiC, Si3Ni4 have been developed.
(The Science And Engineering Of Materials, Donald R. Askeland, P.P. Phulé, pages: 801-802)
2. Conductive Adhesives
A polymer adhesive may contain a filler material such as silver, copper, or aluminum flakes or powders to provide electrical and thermal conductivity. In some cases, thermal conductivity is desired but electrical conductivity is not wanted; alumina, boron nitride, and silica may be used as fillers to provide this combination of properties.
(The Science And Engineering Of Materials, Donald R. Askeland, P.P. Phulé, page: 599 )
3.TPOP (Time-Phased Order Point)
Many companies use economic order or shipping quantity/reorder ponit (Q,R) procedures based on demand forecasts for managing their field inventories. This means decisions for resupply are made independently at the field location, with no integrated forward planning; that is when the on-hand quantity at a location reaches the reorder point, the shipping quantity ordered with no thought given to any other items ordered, to the situation at the factory, or to warehouses-or to when the next order might be needed.
(Manufacturing Planning And Control For Supply Chain Management, Vollmann E., 2005, pg. 269-270)
4.Part Period Balancing
The part period balancing (PPB) procedure uses all the information provided by the requirements schedule. In determining an order’s lot size, this procedure tries to equate the total costs of placing orders and carrying inventory.
(Manufacturing Planning And Control For Supply Chain Management, Vollmann E., 2005, pg. 481)
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