Osman Selçuk Şahin 030060090 8th week

Non structural adhesives:are characterized by relatively low strenght and poor creep resistance at slightly elevated temperatures.The most common non structural adhesives are based on elastomers and thermoplastics.Altough these systems have low strenght they usually are easy to use and fast setting.Because of this characteristics most non structural adhesives are used in assembly line fastening operations where the ultimate joint strength is not required and enviromental service conditions are not severe.(Handbook of adhesives and sealants,p:392)

Structural adhesives:are distinguished from other adhesives by being high strenght materials that are designed to support loads, often substantial loads.These adhesives are also often subjected to cycling high and low temperatures and aggressive fluids or the weather.In general they are used for the bonding of rigid structures although some degree of flexibility and toughness is often desirable in adhesives to counter the effects of movement impact or vibration.(Engineering and structural adhesives,D.J.Dunn,p:3)

Reinforced Plastics:An important class of composites are reinforced plastics that consist of fibers are dispersed in a discontinious manner within a continious matrix of polymer.Reinforced plastics with more than one type of fiber are said to be hybrid.The commonly used fiber materials include glass,graphite,boron nylon,silicon nitride,silicon carbide etc.(Rapid prototyping : laser based and other technologies,Patri K. Venivinod,Weiyin Ma,p:52)

H-Bridge: The control of motors using PWM circuits typically performed by using the H-bridge configuration shown in Fig. 10.1. In this figure, the circuit has been implemented using four IGBT devices as the switches and four P-i-N rectifiers as the fly-back diodes. This is the commonly used topology for medium and high power motor drives where the DC bus voltage exceeds 200 V. When the H-bridge topology is used for applications that operate from a low DC bus voltage, it is typically implemented using four power MOSFET devices as the switches and four Schottky recfiers as the fly-back diodes. ( Fundamentals of power semiconductor devices - B. Jayant Baliga - page 1027 )