Jet Plating (Electroplating Technique)
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Answer:
The most
outstanding application of jet plating is in the electronics industry for the
selected-area plating of lead frames on reel to reel plating machines. The most
important metals are gold and silver but nickel plated from sulphamete baths is
often used as an undercoat. Fast rate plating is achieved by impinging a jet of
solution onto a localized area defined by a gasketed (mask) template.
Multi-layer coatings can be deposited sequentially using this technique. Thin
coatings with good distribution can be achieved in a very economical manner.
Raub has
developed a cell for simulating high-speed electrodeposition by jet plating.
Results are published for the deposition of chromium and palladium/nickel
alloys as well as for other metals. In the case of chromium the mixing of the
electrolyte is not solely due to hydrodynamic flow but also to stirring by gas
bubbles. Comparative information is given for palladium/nickel alloys deposited
by jet plating and rotating cathode techniques. Bocking has reported the results
of high speed selective jet electrodeposition. The purpose of this research is
to achieve direct writing of electrical and electronic devices. Simon has also
described laboratory experiments which made use of high velocity jets of
electrolytes for deposition of
hard gold
coatings at current densities ip to 50 A/dm^2.
(Nickel and
chromium plating, J. K. Dennis,T. E. Such, p.429)
New
Answer: (Better)
Jet plating
is a high-speed electroplating technique. Due to its special flow
characteristics it can be used to localize the electrodeposition reaction on
an unmasked cathode. In this process,
a jet of plating solution is directed to a cathode surface,and
electroplating is done by applying an electric field between the cathode and an anode located in the jet nozzle. Theelectric
current travels along the jet stream to the cathode, and electrodeposition
reaction takes places locally only on thearea where the jet impingeson the cathode surface
( Karakus, C. Chin D.
T. Journal of the Electrochemical Society, Abstract )
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