Friday, April 27, 2012

Deniz Alsan 030080093 10th week

1 - Sand Slinger ( Casting )

new description ( no older found )

A sand slinger shown in figure 1.36. In this machine, moulding sand is thrown into the box by an impeller. The impeller head has a housing. The blade rotates with a very high speed inside the housing. The sand is delivered to the impeller through the opening by conveyor buckets. The impeller head throws the sand through the outlet with a high velocity. Sand at the rate of 500kg. per minute is thrown from the impeller over the pattern. So the sand gets rammed around the pattern. The density of the sand can be controlled by the speed of the blade. This machine is used for large moulds. Sand slinger machine gives uniform ramming. Ramming is quick and initial cost of the machine is high.
( C. Elanchezhian, B. Vijaya Ramnath, Manufacturing Technology - I, p41)

2 - Supply Chain Operational Reference (SCOR)

new description ( no older found )

The SCOR is defined as a process model combining elements of business process engineering, benchmarking, and best practice into a single framework. It was designed to encompass the supply chain from the supplier's supplier to the customers's customer. It integrates business processes definitions, performance indicators and best practices. Under the SCOR model, bets practices are defined as successful standard operating procedures for a given process. Business analysts observe and evaluate various compaines and gather information on what works best. SCOR is based on three process types: Planning, Execution and Enable. The execution process is then divided into Source, Make, Deliver and Return. One additional fact is that the Source, Make, Deliver processes have been documented by manufacturing typologies, in other words: Make to Stock (MTS), Make to Order (MTO) and Engineering to Order (ETO)
( Luis M. Camarinha-Matos, Iraklis Paraskakis, Hamideh Afsarmanesh, Leveraging Knowledge for Innovation in Collaborative Networks, p112)

3 - Cutter Gear Generating Process ( manufacturing)

new description ( no older one )

This process is based on the fack that any two involute gears of the same pitch will mesh together. In the shaper cutter generation process, the cutter is given a reciprocating motion, as in a shaper. It will be capable of cutting a gear blank and generates gear teeth. A gear shaper cutter is shown in the figure 4.47(a).
(Dr. R.Kesavan, B. Vijaya Ramanath, Manufacturing Technology - II, p4.42)


4 - Tool Allocation Policies

new description (no older found )

The simultaneous routing of tools and workpieces presents a new way of looking at workpiece assignment and tool allocation. A normative model for the assignment of workpieces and allocation of tools should incorporate the trade-offs between workpiece and tool transportation. This problem may also be examined from a queueing perspective. In essence, the system may be viewed as having two queueing situations - one for the workpiece (the customers) and another for the tools ( the servers ). Similarly, simulation experiments could be performed to explore the relationship between workpiece assignment and tool allocation under such an environment.
(Jose Mario Azaña Tanchoco, Material Flow Systems in Manufacturing, p363)

5 - Etching ( manufacturing )

new definition ( no older found )

Etching is a corrosion process, in which material is slowly "eaten" away, usually in a chosen pattern. For semiconductor processing applications, wet etching is one of the oldest methods for delineation, but has been replaced by other methods in modern fabs. For the most advanced integrated circuit (IC) technology, wet processing is only used to etch unpatterned layers such as film removal from back surfaces of wafers and hard mask removal from to front surface.
Nevertheless, etching processes are critical with respect to the desired result that must be achieved. Wet etching processes are able to achieve high selectivity with respect to the undelying layer. They also can etch material selective to the crystal structure which dry etching cannot achieve.
(Karen A. Reinhardt, Richard F. Reidy, Handbook for Cleaning for Semiconductor Manufacturing, pp95,96)

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