There is no previous definition.
Definition:
Over the last
few years there has been an increasing trend to further miniaturize the
sensors/actuators from the micro to the nano scale. This is due to some
outstanding properties that these nano-scale materials can offer over conventional
bulk materials. One such nano-scale material is the carbon nanotube (CNT). From
their unique electronic properties and thermal conductivities higher than
diamond to mechanical properties where the stiffness, strength and resilience
exceed any current material, carbon nanotubes offer tremendous opportunities
for the development of fundamentally new material systems. In particular, the
exceptional mechanical properties of carbon nanotubes, combined with their low
density, offer much scope for the development of nanotube-reinforced composite
materials. The potential for nanocomposites, reinforced with carbon nanotubes,
having extraordinary specific stiffness and strength properties, represent
tremendous opportunities for applications in the 21st Century.
CNTs, due to
their superior properties, have immense potential for use in many structural
applications. A single layer of CNTs can achieve 50 times the tensile strength of
conventional steel [53], while the mass density of CNTs is only 1/6 that of steel.
These properties highlight the promising role of CNTs in applications involving
nanomaterials and nanodevices. Theoretically, the tensile modulus and strength
of a graphene layer can reach up to 1 TPa and 200 GPa, respectively.
In addition to
the exceptional mechanical properties associated with carbon nanotubes, they
also possess superior thermal and electric properties. They are thermally stable
up to 2800 C in vacuum, have a thermal conductivity about twice as high as
diamond and an electric-current-carrying capacity 1000 times higher than copper
wire. These exceptional properties have been investigated for devices such as
field-emission displays, scanning probe microscopy tips and microelectronic
devices.
(Varadan, V.
K., Smart
Material Systems and MEMS: Design and Development Methodologies, p. 35)
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