Saturday, April 21, 2012

Metin Atmaca 030080007 9th week definitions


1. Contact Adhesives (Material)

There is no previous definition.

Definition:

Contact adhesives are made from polymer components which are already in a highmolecular state, but which are not yet chemically crosslinked. By means of the addition of solvents, a low-viscosity state is obtained which allows the adhesive to wet the surface of the solid material. Contact adhesives must be applied to both adherents, and solidification takes place by a drying process before the materials are joined. The adherents are pressed together as soon as the adhesive layers are dry to the touch.

During the application of pressure, and even afterwards, a diffusion process takes place between the adhesive molecules of both coats, firmly joining the adherents together. The strength of the bond can increase, often within hours, after the application of pressure. If at least one adherent is porous, the adherents can be joined before the drying process has taken place at all or only partly, because the remaining solvent is capable of evaporating through the porous adherent. In this case, it is also possible to reposition the adherents after having joined thembecause, in the semi-dry condition, the adhesive still largely presents the properties of a liquid.

In the dried or cured condition, the adhesive coat is generally in the thermoplastic state – that is, the molecules are not three-dimensionally crosslinked. As a consequence, the adhesive coats applied do not present the same resistance to heat and creep as chemically cured adhesives. It is possible, however, to add slowly acting hardeners to these polymer systems; this induces a three-dimensionally widemeshed crosslinking of the systems over the course of several days. While the addition of hardeners does not alter the processing properties of the contact adhesives, the durability and strength of the cured system is considerably improved. One disadvantage of contact adhesives is an occasional very high solvent content (up to 80% by weight), so that appropriate protective measures must be taken during processing.

As a consequence, solvent-containing contact adhesives are now being replaced, when possible, by so-called .dispersion adhesives. These consist of a dispersion of the adhesives in water, during the evaporation of which the dispersed polymer particles combine by diffusion. Unfortunately, dispersion adhesives have the disadvantage that the drying process of water takes considerably longer than that of solvents, and an acceleration can only be obtained by the application of heat, which requires additional energy input. Furthermore, during the drying process, dispersion adhesives develop inadequate tack, a property which is desirable in many cases.Adrawback of this approach is that the strength and durability of dried adhesive coats are generally poorer than those of solvent-containing contact adhesives; this occurs because the polymer layer created is not absolutely homogeneous and has a tendency to redisperse under the influence of moisture.

(Brockman, W. et al, Adhesive Bonding, p. 33)





2. One-Part Adhesives (Material)



Previous Definition:

One-part adhesives are preferred over two part adhesives for surface mounting because it is a nuisance to have to mix two-part adhesives in the right proportions for the right amount of time. One-part adhesives, eliminating one process variable in manufacturing, are easier to apply, and one does not have to worry about the short working life(pot life) of teh mixture. The single- part adhesives have a shorter shelf life, however. The terms “shelf life” and “pot life” can be confusing. “Shelf life” refers to the usable life of the adhesive as it sits in the container, whereas “pot life,” as indicated above, refers to the usable life of the adhesive after the two main components( catalyst and resin) have been mixed and catalysis has begun.
(Ray P. Prasad, Surface Mount Technology: Principles and Practice, p. 340)

New Definition (Better):

A.   Hot-Setting, One-Part Adhesives

Although, one-part systems are considerably easier to process than either two-part or multi-part adhesives, on most occasions it will be necessary to apply heat. One-part adhesives consist of low-molecular and plastified substances. In general, the base resins are phenolic resins, epoxy resins and, for the creation of high-temperature adhesives, polybenzimidazoles and polyimides.

With regard to phenolic resins and polyimides, the crosslinking process takes place in the form of polycondensation, and consequently additional pressure must be exerted on the bond-line during the setting process. Heat must also be applied in order to remove water from the bond-line, while the pressure must be higher than the water-vapor pressure at the setting temperature (i.e. generally >500 kPa). In contrast, contact pressure is dispensable with hot-setting epoxy resins, because the setting reaction takes place as polyaddition. Only in the case of extended-surface bonds need contact pressure be applied to the adherents because, in the noncured state, these adhesives are not capable of transferring any mechanical forces, and any deformation of the adherents may result in destruction of the bond.

B.   Cold-Setting, One-Part Adhesives

Besides setting via heat, several other physical effects like absence of oxygen in the glue line or presence of moisture at the adherent surfaces can be utilized in order to initiate a curing reaction. The most common one-part adhesives are based on an initiation by irradiation (e.g. UV light), by an absence of oxygen (anaerobic), or by exposure to moisture. Owing to the precise control of the curing process, systems setting under the influence of UV light or light (most of which are based on acrylates or epoxy resins) have been increasingly used to date. In lowmolecular base resins, photoinitiators are dissolved or chemically incorporated which initiate the crosslinking process under irradiation with UV light or visible light. Two such groups of adhesive may be distinguished: those that set exclusively under continuous irradiation (radical reaction mechanism); and those in which crosslinking is initiated by short irradiation of the open bond-line and continues to take place after joining, without further irradiation (ionic reaction mechanism).

Cold-setting, one-part adhesives which crosslink under the effect of moisture (e.g. one-part polyurethane and silicon resin systems) are often used as sealing compounds. In the noncured state these adhesives are low-molecular and noncrosslinked. However, at the bond-line they are set by the effect of moisture diffusing from the outside, which results in a three-dimensionally, chemically crosslinked system with high plasticity. Silicon resins, for example, have a high plasticity and are characterized by the fact that their strength and deformation properties are virtually unaffected over a temperature range from –55 to +250 C.

(Brockman, W., et al, Adhesive Bonding, p. 36)

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